Mechanical Engineering Technical Leader

Cisco

Remote

Quick summary

Work type
Remote
Location
San Jose, CA
Salary
$168,800–$241,200 / yr
Posted
6 days ago
Closes
Jul 31, 2026
Nearby
99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $176k
This role $205k
$125k most similar roles pay here $254k

This role pays more than 76% of similar roles. Most pay $146,500–$205,000 — the shaded band above. At the midpoint, this role pays about $205k versus about $176k for comparable roles.

Based on 238 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 167 open roles on FindRole.

Listed pay typically runs $168,800–$241,400 across 167 roles with salary data.

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View all roles at Cisco

At a glance

TL;DR · Mechanical Engineering Technical Leader

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The Cisco ASIC Group is hiring a senior-level ASIC Mechanical Engineer to lead mechanical and thermomechanical simulation efforts for high-performance systems. This role involves performing advanced finite element analysis (FEA) to assess the reliability of ASIC packages and board assemblies, driving solder joint reliability assessments, and developing predictive methodologies. The engineer will establish simulation best practices, correlate simulations with real-world testing data, and provide critical insights to cross-functional teams. Key skills include expertise in ABAQUS or ANSYS for nonlinear material modeling, experience with Python or Fortran for automation, and a deep understanding of solder joint reliability analysis. Ideal candidates have a background in mechanical engineering and hands-on experience with board-level reliability (BLR) standards and advanced packaging technologies.

Skills

ABAQUS ANSYS Python Fortran FEA solder joint reliability analysis nonlinear material modeling board-level reliability (BLR) PCB–package interaction modeling Coffin-Manson Darveaux JEDEC standards IPC standards advanced packaging flip chip 2.5D/3D integration heterogeneous integration

What you'll do

  • Lead advanced finite element analysis to evaluate thermomechanical behavior of ASIC packages and board-level assemblies.
  • Own solder joint reliability assessments, including thermal cycling and mechanical shock tests.
  • Define simulation methodologies and modeling best practices for packaging and board-level reliability.
  • Drive correlation between simulations and physical testing to improve predictive accuracy.
  • Influence product design by providing data-driven recommendations early in the development cycle.
  • Develop and scale simulation workflows using Python or Fortran to enhance team efficiency.

What we're looking for

  • Bachelor’s degree in mechanical engineering or related field with 8+ years of experience.
  • Expertise in thermomechanical simulation and solder joint reliability analysis for semiconductor packages.
  • Proficient in using ABAQUS or ANSYS for nonlinear material modeling and stress analysis.
  • Strong background in fatigue and creep modeling, including solder constitutive models.
  • Experience driving technical decisions and collaborating with global engineering teams.

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