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IC Packaging Simulation Engineer

Austin Metro Area, Texas, United StatesHardware

Austin Metro Area, Texas, United StatesSan Francisco Bay Area, California, United StatesWork Locations (2)

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Summary

Posted: Apr 20, 2026

Role Number:200657856-0240

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result?
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS.
This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization.

Description

• In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
• You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.

Responsibilities

• Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
• Actively exploring the feasibility during product package definition and identifying risks of reliability and product yield through simulation.
• Supporting new product introduction (NPI), solving problems emerging from product development and manufacturing.
• Programming or scripting CAD/FEM software, and Gen-AI/ML/numerical tools to set up automated model-generation user interfaces and maintain those codes.

Minimum Qualifications

• Minimum requirement of a bachelors degree

Preferred Qualifications

• Proven capability in mechanics and mathematics.
• Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.).
• Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python.
• Hands-on experience of Gen-AI and Machine Learning.
• Deep understanding of packaging materials and their mechanical behaviors.
• Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus.
• Able to perform independent research and development work.
• Excellent written and verbal communication skills with ability to present ideas, design concepts, data, and plan with high confidence at team meetings.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

Apple accepts applications to this posting on an ongoing basis.

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